Mechanical Engineering Intern — Summer 2026
StructureIQ
About StructureIQ
StructureIQ is an early-stage, AI-powered structural health monitoring (SHM) company based in Champaign, Illinois, commercializing technology exclusively licensed from the University of Illinois Urbana-Champaign (UIUC). Our Sentinel AI platform, combined with our wireless Xnode IoT sensor hardware, delivers continuous structural risk assessment and Structural Condition Index (SCI) scoring to the insurance industry and asset owners worldwide.
About the role
We are seeking a motivated Mechanical Engineering intern to join our team for the summer. This is a hands-on role with direct impact on a new product line — the Xnode Pro — currently in active development. You will work alongside our founding engineering team and contribute to real design decisions that will shape the next generation of our sensor hardware. This role is well suited to a student with a strong interest in product design, enclosure engineering, or hardware development, who is comfortable operating in a fast-moving startup environment with a degree of ambiguity. This internship is based in Champaign. We anticipate a summer engagement of approximately 10 to 12 weeks, with start dates flexible from late May through early June 2026.
What We Offer
- Paid summer internship with a competitive hourly rate
- Direct exposure to early-stage hardware product development at a deep-tech startup
- Mentorship from experienced engineers and access to a talented, multidisciplinary founding team
- Opportunity to contribute to a product that will be deployed in real-world infrastructure monitoring applications
- Flexible start and end dates to accommodate your academic schedule
Responsibilities
- Support the mechanical design of the Xnode Pro sensor enclosure, including external components, connector placement, and battery integration
- Evaluate and selection of 3D printing methods and materials for prototype fabrication
- Develop CAD models of the enclosure using traditional parametric CAD tools
- Support waterproofing design work, including evaluation of sealing approaches for USB ports, antennas, and other external interfaces
- Research and engage with 3D printing service providers (including campus facilities, online bureaus, and commercial vendors) to establish input requirements and obtain quotes
- Document design decisions, component selections, and test results in a clear and organized manner
- Collaborate with the engineering team on component arrangement, assembly considerations, and design-for-manufacture feedback
Requirements
- Currently enrolled in a Bachelor’s or Master’s program in Mechanical Engineering or a closely related field at UIUC
- Proficiency with at least one parametric CAD tool (SolidWorks, Fusion 360, FreeCAD, or equivalent)
- Strong interest in physical product design and hardware development
- Ability to work independently and manage multiple tasks with minimal supervision
Preferred Qualifications
- Prior experience with 3D printing processes (FDM, SLA, SLS, or similar)
- Familiarity with enclosure design, IP ratings, or waterproofing techniques
- Exposure to electronics integration in mechanical assemblies
- Experience with prototyping or maker-space environments (e.g., UIUC Maker Lab, mHub Chicago, or similar)
To apply, please send your resume and a brief note describing your interest in this role to: