Engineering Intern

Company Name: 
Post Date:  

Engineering Intern


Company Overview:


ATSP Innovations is developing and commercializing a new family of ultra high temperature polymers (Aromatic Thermosetting coPolyesters) for use in coatings, composites, and foams. Potential hires would be working on NASA-funded projects for in-space assembly and novel bonding techniques.


Job Summary:


We are looking for interns who have a physical sciences background to work in the ATSP Innovations office at Champaign, IL. This role is needed immediately.


Job Duties:

  • Materials synthesis and characterization
  • Data manipulation and representation
  • Routine laboratory processes including coating deposition, monitoring ongoing synthetic processes, material handling, glassware and surface cleanup
  • Optical microscopy and associated image analysis tasks
  • Operation of thermal characterization experiments (DSC/TGA)
  • Organization/conversion of data into usable forms for making graphs
  • Sample organization/labelling and interfacing with shipping entitiesIn-lab mechanical characterization tasks


Job Qualifications:

  • Laboratory experience especially related to wet chemistry, composites, polymers, or materials characterization
  • Experience with Excel and OriginPro
  • Ability to work with little supervision and to work cooperatively with all personnel in the organization
  • Candidates should be able to maintain 15-20 hours/week during the academic year
  • Must be U.S. citizen or permanent resident without requiring sponsorship


Preferred Skills:

  • Previous laboratory skills related to polymers and composites or industrial experience is preferred
  • Previous Matlab experience is a bonus


Education Requirement:


Bachelor’s (at least Junior standing) or graduate standing in Chemistry, Materials Engineering, Mechanical Engineering, Electrical Engineering, Aerospace Engineering, Chemical Engineering, Physics, and related fields


To apply


Please email your resume and a short paragraph of your background summary to Jacob Meyer at

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